Laser marking techniques

ABSTRACT

A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy, is present. The heat associated with the laser beam causes the laser reactive material to fuse to the surface of the chip, creating a visibly distinct mark in contrast to the rest of the surface of the chip. Only reactive material contacted by the laser fuses to the chip surface, and the remaining residue on the non-irradiated portion can be readily removed.

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application is a continuation of application Ser. No.09/625,938, filed Jul. 26, 2000, now U.S. Pat. No. 6,217,949, issuedApr. 17, 2001, which is a continuation of application Ser. No.09/358,178, filed Jul. 20, 1999, now U.S. Pat. No. 6,113,992, which is acontinuation of application Ser. No. 08/944,684, filed Sep. 30, 1997,now U.S. Pat. No. 5,985,377, issued Nov. 16, 1999, which is acontinuation of application Ser. No. 08/584,246, filed Jan. 11, 1996,abandoned.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] This invention relates generally to laser marking techniques and,more specifically, to an apparatus and method for marking the surface ofa bare or packaged semiconductor device, comprising one or more dice,using a laser and a laser reactive material.

[0004] 2. State of the Art

[0005] Since the first semiconductor devices became commerciallyavailable, manufacturers have found it necessary to mark each chip orassembly of chips (bare die or package) with the company name, a part orserial number, or other information such as lot number or die location.Conventional marking methods utilize a mechanical device to transfer inkcontained in an ink pad to the surface of a stamp. An individual chip isthen stamped, and the automated process is repeated for subsequentchips.

[0006] Because of its mechanical nature and the drying time associatedwith ink, an ink stamping process is relatively slow. Moreover, if themark is accidentally touched prior to complete drying, the mark willsmudge. In chip manufacturing processes using such an ink stampingmethod, the ink marking operation may have to be included at arelatively early stage of production (if the die itself is to be marked)or just after post-encapsulation processing (if the package is to bemarked) to allow for drying time without affecting the production rate.Such early marking may result, however, in marking defective chips thatnever make it completely through the manufacturing process.

[0007] Another problem associated with ink stamping methods is that thequality of ink stamped marks may substantially vary over time. Thisvariation may be dependent upon the quantity of ink applied, ambienttemperature and humidity, and/or the condition of the surface of thestamp. In any event, the consistency of a stamped mark may vary widelyfrom chip to chip.

[0008] As a result of the deficiencies associated with ink stamping, ithas become increasingly popular to use a laser beam to mark the surfaceof a chip. Unlike ink stamping, laser marking is very fast, requires nocuring time, has a consistently high quality, and can take place at theend of the manufacturing process so that only good chips are marked.

[0009] Various machines and methods have been developed for marking achip with a laser. As illustrated in U.S. Pat. Nos. 5,357,077 toTsuruta, 5,329,090 to Woelki et al., 4,945,204 to Nakamura et al.,4,638,144 to Latta, Jr., 4,585,931 to Duncan et al., 4,375,025 toCarlson, a semiconductor device is placed in a position where a laserbeam, usually produced by a carbon dioxide, Nd:YAG, or Nd:YLF laser,inscribes various characters or other information on a surface of thesemiconductor device. Basically, the laser beam bums the surface of thechip such that a different reflectivity from the rest of the chipsurface is formed. By holding the chip at a proper angle to a lightsource, the information inscribed on the chip by the laser can be read.

[0010] Various materials are known in the art that are laser reactive(e.g., capable of changing color when contacted by a laser beam). Asdescribed in U.S. Pat. Nos. 4,861,620 to Azuma et al., 4,753,863 toSpanjer, and 4,707,722 to Folk et al., the part or component may bepartially comprised of the laser markable material or have a coating ofthe material on the surface of the part or component to be marked.

[0011] Using a laser to mark a chip is a fast and economical means ofmarking. There are, however, certain disadvantages associated withstate-of-the-art laser marking techniques that merely bum the surface toachieve the desired mark in comparison to ink stamping. For example, inkstamping provides a clearly visible image on the surface of a chip atnearly every angle of incidence to a light source. A mark burned in asurface by a laser, on the other hand, may only be visible at selectangles of incidence to a light source. Further, oils or othercontaminants deposited on the chip surface subsequent to marking mayblur or even obscure the mark. Additionally, because the laser actuallybums the surface of the work piece, for bare die marking, the associatedburning may damage the internal circuitry of the chip directly or byincreasing internal die temperature beyond acceptable limits. Moreover,where the manufactured part is not produced of a laser reactivematerial, laser reactive coatings applied to the surface of a componentmay take hours to cure.

[0012] Thus, it would be advantageous to provide a marking techniquethat combines the speed and precision of laser marking with the contrastand distinctiveness of ink stamping, without any substantial curing ordrying time. Moreover, it would be advantageous to develop a method andapparatus for marking the surface of a semiconductor chip that does notharm the circuitry enclosed therein.

SUMMARY OF THE INVENTION

[0013] According to the present invention, a laser marking apparatus andmethod are disclosed wherein an object is subjected to a laser beam orother suitable energy source for marking purposes. While the laser beamis actively marking, a substance is introduced into the marking workarea that interacts with the laser beam. The substance reacts with thelocalized heat created by the laser and forms a new compound on thesurface of the package or surface of the chip. This new compound isselected to contrast highly with the color and/or surface texture of thesurface that has been marked.

[0014] In another particular aspect of the invention, the surface of achip is at least partially covered with a laser reactive substance priorto being contacted by a laser beam. The substance may be in eitherliquid or powder form and may be rolled on, sprayed on, or otherwiseapplied by means known in the art. When subjected to the localized heatcreated by the laser, a semi-permanent, solvent-removable mark is formedand bonded to the surface of the chip. The excess material on thenon-irradiated portion, that is, the portion of the surface notcontacted by the laser beam, is readily removed by an exhaust or residueremoval system and may be recycled for future marking.

[0015] In another, more particular aspect of the invention, an inkbearing material, or other pigmented or laser reactive substance-bearingmaterial, is disposed adjacent to an exposed surface of a chip. Thelaser beam transfers ink contained in the ink bearing material to theexposed surface of the chip. For example, the ink bearing material maycomprise a ribbon contained in a ribbon dispenser. During the markingprocess, as the laser beam transfers ink from one point on the ribbon tothe chip, another segment of the ribbon may be exposed to the laser beamfor subsequent markings. Such an ink bearing material may also help toreduce heat produced by the laser beam from substantially penetratingthe surface of the marked chip.

[0016] In a more particular aspect of the invention, a stream ofatomized particles of B-stage epoxy with an added pigment of a desiredcolor (white for example) is directed at the surface where the laser isactively marking the specimen. The epoxy reacts to the heat of the laserand cures to a visible white image coincident with the path of thelaser. The excess particles, those which have not been directlyirradiated by the laser beam, may be removed along with other debrisfrom the work area by a debris removal system.

[0017] In another, more particular aspect of the invention, much of theepoxy is destroyed by the laser. A thermal gradient, however, along thetrailing edge of the laser path causes the epoxy to cure normally into afinal and permanent state, thus producing the desired mark.

[0018] In another particular aspect of the invention, the laser reactivematerial absorbs most of the heat produced by the laser. As a result,the delicate internal circuitry of the chip is not exposed to thispotentially damaging heat.

[0019] In another aspect of the invention, subsequent to, or while beingmarked, the chip is subjected to a jet of coolant to rapidly cool themarkings and prevent or reduce the potential for heat damage to thechip. The coolant may be in a liquid, gas, or solid state. In thismanner, any residual heat contained in the marking material or presentin the surface of the chip may be rapidly dissipated. The markings arethus completely cured and/or cooled before exiting the markingapparatus.

[0020] In another, more particular aspect of the invention, the lasermarking apparatus is computer controlled. In addition to controlling thelaser beam, chip location, and other process parameters, the centralprocessing unit (CPU) may control the quality of markings. If so, themarked chips may be subjected to a camera which feeds an image of eachchip to the CPU. The CPU compares the pixels of the captured image to agiven resolution standard. If the marking is of a sufficiently highquality, the chips are automatically accepted. If not, the chips areautomatically rejected for rework and remarking.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0021]FIG. 1 is a schematic side view of a laser marking apparatus inaccordance with the present invention;

[0022]FIG. 2 is a perspective view of a chip contained in a firstembodiment of a chip carrier in accordance with the invention shown inFIG. 1;

[0023]FIG. 3 is a close-up perspective view of a magazine and chipscontained therein in accordance with the invention shown in FIG. 1;

[0024]FIG. 4 is a perspective view of a second embodiment of a chipcarrier in accordance with the present invention;

[0025]FIG. 5 is a perspective view of a portion of track in accordancewith the chip carrier shown in FIG. 4;

[0026]FIG. 6 is a close-up schematic side view of a first embodiment ofa laser marking apparatus in accordance with the present invention;

[0027]FIG. 7 is a close-up schematic side view of a second embodiment ofa laser marking apparatus in accordance with the present invention;

[0028]FIG. 8 is a close-up schematic side view of an alternateembodiment of a roller-type applicator in accordance with the presentinvention; and

[0029]FIG. 9 is a perspective view of a packaged semiconductor devicepositioned on a track in accordance with the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0030] Referring to FIG. 1, a laser marking apparatus 10 in accordancewith the present invention is illustrated. Generally, the chips (theterm “chips” as used herein refers to both bare and packaged dice, asthe invention has equal utility in the marking of both) 12 areautomatically fed through the laser marking apparatus 10 for markingpurposes. The chips 12 may be fed by a belt, chain, or pneumaticconveyor system as known in the art, gravity fed as shown in FIG. 1, ordelivered by other means known in the art. The chips 12 are firststacked in a feed magazine 16 (FIG. 3). When released from feed magazine16 by a mechanical release mechanism as known in the art, the chips 12exit through an opening 18 located proximate the bottom 20 of the feedmagazine 16 onto the low-friction track 14.

[0031] As shown in FIG. 2, the chips 12 are secured in carriers 11,preferably made of a statically dissipative material, such as certainplastics and other materials known in the art. The chip carriers 11 maybe used to handle the chips 12 during many phases of the manufacturingprocess, up to and including shipment. The chips 12 are placed on a base17 and held in place by projections 19, 21, 23, and 27. Legs 33, 35, 37and 39 extend downwardly from the bottom 41 of the base 17. The legs 33and 35, as well as legs 37 and 39, are separated by a distance D1sufficient to allow passage of the track 14. Moreover, legs 35 and 39,as well as legs 33 and 37, are separated by a distance D2 to allowprojections 23 and 19 to fit respectively therein whenever the chips 12are stacked in their respective carriers 11.

[0032] As seen in FIG. 3, the chips 12 are stacked in the feed magazine16. The chips 12, suspended above the track 14 by the feed magazine 16,are individually released onto the track 14 and allowed to slide by theforce of gravity down the track 14. The feed magazine 16 automaticallyreleases the chips 12 at constant or selectively variable intervalsdictated by process requirements. The feed magazine 16 may vary in sizeto accommodate large or small numbers of chips 12 and each carrier 11may vary in size to accommodate one or more dice.

[0033] Carriers 11 may also be in elongated form to accommodate aplurality of chips 12 to be marked. As depicted in FIG. 4, an empty chipcarrier 82 is capable of holding at least four (4) chips 12. The chipcarrier 82 may also be modified to hold several dice that have not beencut apart (if increased in size) or an entire wafer (if modified to holdround rather than rectangular objects). Chips 12 are held in the carrier82 by elements 84 which provide an interference or resiliently-biasedfit, as desired, between the carrier 82 and a chip 12. Moreover, thechips 12 rest upon the lip 86 so that each chip 12 held by the carrier82 extends equally above the top surface 88 of the carrier 82.

[0034] The carrier 82 is adapted to slide along a track positioned inseveral different orientations, such as a track 90 shown in FIG. 5. Thecarrier 82 has legs 92 and 94 depending from and separated bycross-members 96, 98, 100, 102 and 104 extending the length of thecarrier 82. The legs 92 and 94 are parallel to each other, have lateralextensions 106 and 108, respectively, spaced from the cross-members 96,98, 100, and 102 running the length of the legs 92 and 94 and projectinginwardly for grasping the elongate rails 110 and 112 of the track 90.

[0035] The rails 110 and 112 of the track 90 are shown orientedback-to-back and having a “C” shaped cross-section and are spaced apartby members 107. When the carrier 82 is riding on the top of the track90, the lateral extensions 106 and 108 grasp the top portions 114 and116 of the rails 110 and 112, respectively. If the carrier 82 issuspended from the bottom of the track 90 (in an inverted orientation),the lateral extensions 106 and 108 grasp the bottom portions 118 and120, respectively. Moreover, because the carrier 82 is designed toactually grasp the track 90 rather than merely ride on it, the track maybe placed in any orientation.

[0036] When the chips 12 are placed in the carrier 82 and the carrier 82is positioned on the track 90, the marking operation may occur on eitherside. That is, because both sides of the chip 12 are exposed, neitherthe top nor the bottom of the chip 12 has any substantial portioncovered by the carrier 82. If the chips 12 in the carrier 82 areautomatically inspected, defective chips 12 may be automatically poppedout of the carrier 82. A solvent or other substance, or even ade-marking laser, may be used to remove the defective mark and the chip12 may then be reloaded into a carrier 82 and remarked. Thus, therequirements of the process and of the marking and inspection apparatuscan dictate the orientation of the track 90, the carriers 82 thereon,and the chips 12 in the carriers 82.

[0037] The carrier 82 is also suited for stacking with other similarcarriers. Extending longitudinally along the length of the top surface88 of the outside edges 103 and 105 of the carrier 82 are channels 95and 97 sized and shaped to receive extensions 99 and 101 extendingdownwardly from legs 92 and 94, respectively. The extensions 99 and 101also extend longitudinally the length of the carrier 82 along the bottom93 of the carrier 82. The extensions 99 and 101 extend downwardly fromthe lateral extensions 106 and 108, respectively, a sufficient distanceso that when stacked, the lateral extensions 106 and 108 are spacedabove the chips 12 contained in the carrier 82.

[0038] For typical packaged dice (chips) 122, such as that shown in FIG.6, the chip 122 can ride directly on the track 14 without being placedin a carrier. The connecting tabs 124 located on the sides 126 and 128of the chip 122 keep the chip 122 properly aligned on the track 14.Moreover, the track 14 is of a width W so that the chips 122 stay inlongitudinal and latitudinal alignment with the track 14. The chips 122can also be loaded onto the track 14 by a feed magazine of a modifiedversion of feed magazine 16 and loaded into a shipping magazine such astubular shipping magazine 50 (FIG. 1).

[0039]FIG. 1 shows laser marking apparatus 10 of the present inventionin a gravity feed arrangement where the track 14 is placed at an angle Arelative to the horizon such that the force of static friction betweenthe carriers 11 and the track 14 is less than the force of gravity alongthe line of the track 14 on the carriers 11. When the chips 12 arereleased from the feed magazine 16, several chips 12 are staged, six (6)in this case, by automated indexing pins 22 and 24 at the initialstaging area 13. Once the chips 12 are staged, indexing pin 24 isretracted to allow the staged chips 12 to slide on the track 14 untilstopped by indexing pin 26 at the marking area 25. The chips 12 are heldin place by indexing pin 26 until all of the chips 12 retained byindexing pin 26 are marked by the laser 28. The laser 28 may becomprised of a carbon dioxide, Nd:YAG, Nd:YLF laser or other suitablelasers or devices, such as an electron beam emitter, known in the art.The laser 28 is longitudinally translatable along the support 30 in atleast one direction so that all of the chips 12 retained by indexing pin26 can be marked by the laser 28 in a single pass.

[0040] Once the laser 28 marks the chips 12, indexing pin 26 isretracted and the chips 12 are allowed to slide until retained byindexing pin 32 at the debris removal and inspection area 31. As thechips 12 pass from indexing pin 26 to indexing pin 32, they slide underthe debris removal system 34. The debris removal system 34 may employsuction, forced air and/or other methods known in the art to clean thesurface 54 of the chip 12 (FIG. 7) without disturbing the markingsthereon (not shown). Moreover, any marking material that remains in therecovered residue may be reprocessed for future chip marking.

[0041] The chip 12 adjacent the indexing pin 32 is then inspected by thecamera 36 which may be a CCD camera or other suitable camera known inthe art. That is, the camera 36 photographs the image of the surface 54of the chip 12 and the markings contained thereon and sends this imageto a central processing unit, such as CPU 80 in FIG. 1. The imagereceived by the CPU 80 is broken down into individual pixels and thepixels are compared to a minimum standard. Once the image is receivedand compared by the CPU 80, each chip 12 is released by the indexing pin32. The adjacent, upstream chips 12 are maintained in position by theindexing pin 38 until each is released for inspection. If the chip 12released by the indexing pin 32 is acceptable according to thecomparison made by the CPU 80, then the chip 12 is allowed to slide onthe track 14 to the final staging area 40. If the chip 12 is determinedby the CPU 80 to be unacceptable, a trap door 42 is opened and the chip12 falls into a bin 44 so that the chip 12 may be reworked and remarked.

[0042] An electronic eye 46 is positioned to identify when a propernumber, in this case six (6), of acceptable chips 12 are ready to bepackaged. Once the proper number of chips 12 is achieved, the indexingpin 48 is activated until all of the chips 12 held in the final stagingarea 40 have been loaded into a shipping magazine 50.

[0043] The apparatus 10 disclosed herein only requires an operator toload the feed magazine 16 with chips 12 to be marked and to remove andreplace the shipping magazine 50 when full. The rest of themarking/inspection operation is completely automated and controlled bythe CPU 80. Moreover, it is possible for the CPU 80 to control multipletrack arrangements simultaneously.

[0044] Referring now to FIG. 7, a close-up view of the laser 28 inrelation to the chip 12 is shown. The laser 28 projects a movable laserbeam 52 onto the surface 54 of the chip 12 to mark the chip 12. As thelaser beam 52 is directed toward the chip surface 54, a laser reactivemarking material 58 is injected through an applicator or nozzle 60 ontothe chip surface 54 at the same location 56 that the beam contacts thechip 12. The heat from the laser beam 52 fuses the laser reactivemarking material 58 onto the chip surface 54. Laser reactive markingmaterial 58 present on any non-irradiated portion of the chip 12 thathas not been exposed to the laser beam 52 and is therefore unreacteddoes not bond to the chip surface 54 and is subsequently removed.

[0045] A coolant 62 may also be injected from a coolant injector ornozzle 64 onto the surface 54 of the chip 12 and onto the markingmaterial 58 present on the chip surface 54. If a coolant 62 is used, anyresidual heat contained in the chip 12 or the marking material 58 may bequickly dissipated. This may be necessary to help protect the delicatecircuitry of a bare die from the heat of the laser beam 52. The laser 28is shown without the coolant nozzle 64 in FIG. 1. The use of a coolant62 also prevents or insures the laser reactive marking material 58,which may be an epoxy material that may cure at a relatively lowtemperature, from curing prematurely, thereby decreasing the need forrelatively high curing temperature epoxies to be used in the markingprocess.

[0046] As can be seen, both the pigment nozzle 60 and the coolant nozzle64 are attached to the laser 28 so that any movement of the laserresults in movement of the nozzles 60 and 64. Thus, the laser 28 and thenozzles 60 and 64 translate together, and are thus synchronous, so thata minimum amount of laser reactive marking material 58 and coolant 62 isrequired. Moreover, the marking location immediately surrounding thetarget surface on each chip 12 for laser beam 52 may be placed in areduced or negative pressure environment with respect to the surroundingwork area by means known in the art to reduce overspray that mayotherwise settle on the chip 12 or drift onto the track 14 or otherparts of the apparatus 10.

[0047] In FIG. 8, an alternate embodiment is shown having a ribbondispenser 66 comprised of a feed reel 68 and a take-up reel 70. Theribbon dispenser 66 dispenses a ribbon or strip of ink bearing material72 from the feed reel 68 to the take-up reel 70. The ribbon 72 extendsover and is proximate to the surface 54 of the chip 12. The ribbon 72may also extend over a number of chips 12 or several ribbon dispensers66 may be placed side by side so that marking of several chips 12 canoccur sequentially or so that multiple colors may be used in the markingprocess. The chips 12 are allowed to pass under the ribbon 72 as theyslide along the track 14. When the chips have moved to the marking area25, the laser 28 projects a laser beam 52 onto the surface of the ribbon72 and transfers ink from the ribbon 72 onto the surface 54 of the chip12. One advantage of the embodiment of FIG. 8 is the elimination ofliquid pigments and coolants, the latter being due to absorbance of thelaser energy by the ribbon 72 carrying the marking material. Anotheradvantage is that the marking process using a ribbon 72 is cleaner inthat no excess particles of marking material are present in the markingarea to contaminate the marking area and chip in undesired areas.

[0048] Referring to FIG. 9, the laser reactive material may be appliedby a motorized roller 130 rotatably attached to a roller support 135. Anopen-celled sponge or fiber pad 132 is held against the roller 130 by asupport member 134. The support member also supplies the laser reactivematerial to the pad 132, the arrangement functioning like a shoe-polishapplicator. The roller is held in contact with the top surface 54 of thechips 12 and forces the chips 12 between the roller and the track 14.Because the pad 132 continually supplies laser reactive material to theroller 130, each chip 12 receives a consistent layer of material. Thechips 12 can then be laser marked. The application of laser reactivematerial to the roller 130 could also be achieved by spray, drip orother methods known in the art.

[0049] While the present invention has been described in terms ofcertain preferred embodiments, it is not so limited, and those ofordinary skill in the art will readily recognize and appreciate thatmany additions, deletions and modifications to the embodiments describedherein may be made without departing from the scope of the invention ashereinafter claimed. As used in the claims, as in the precedingspecification, the term “chip” or “chips” is intended to mean andencompass both bare, both the circuit side and/or back (Si) side of thesemiconductor dice, and packaged semiconductor dice.

[0050] Additionally, while the invention has been described inconjunction with the use of a laser as an energy source for the markingof a chip or chips, any suitable energy source may be used in place ofthe laser energy source, such as a focused ultraviolet light source,electron beam, focused and directed hot air source, etc.

What is claimed is:
 1. A method for marking a semiconductor device,comprising: providing energy reactive marking material over a surface ofthe semiconductor device; and exposing at least selected portions of atleast one of said surface and said energy reactive marking material toenergy to form of a mark on said surface without substantially creatingan imprint in said surface.
 2. The method of claim 1 , wherein saidproviding comprises directing a stream of said energy reactive markingmaterial at least proximate selected portions of said surface.
 3. Themethod of claim 1 , wherein said providing comprises disposing an energyreactive marking material comprising a pigment onto said surface.
 4. Themethod of claim 1 , wherein said providing comprises disposing a quicklycuring energy reactive marking material onto said surface.
 5. The methodof claim 1 , wherein said providing comprises dispensing said energyreactive marking material onto said surface.
 6. The method of claim 1 ,wherein said providing comprises rolling said energy reactive markingmaterial onto said surface.
 7. The method of claim 1 , wherein saidexposing comprises placing the packaged semiconductor device in a pathof an energy beam.
 8. The method of claim 7 , further comprisingtranslating said energy with said stream of said energy reactive markingmaterial.
 9. The method of claim 1 , wherein said exposing effects acolor reaction of said energy reactive marking material.
 10. The methodof claim 1 , wherein said exposing effects an absorption of energy bysaid energy reactive marking material.
 11. The method of claim 1 ,wherein said exposing and said providing form said mark with a non-wetfinish.
 12. The method of claim 1 , wherein said exposing comprisesexposing said selected portions to a laser beam.
 13. The method of claim1 , wherein said exposing comprises exposing said selected portions tofocused light.
 14. The method of claim 1 , wherein said exposingcomprises exposing said selected portions to heat.
 15. The method ofclaim 1 , further comprising inspecting a quality of said mark.
 16. Themethod of claim 15 , further comprising rejecting the packagedsemiconductor device if said mark is not within selected quality controlparameters.
 17. The method of claim 1 , further comprising exposing saidselected portions to a coolant either during or immediately subsequentto said exposing at least selected portions to energy.
 18. The method ofclaim 1 , wherein said providing and said exposing occur withoutdamaging or decomposing said surface.
 19. The method of claim 1 ,wherein said exposing is effected either substantially simultaneouslywith said providing or immediately thereafter.
 20. The method of claim 1, wherein said exposing and said providing effect at least one of fusingand bonding energy reactive marking material to said surface.
 21. Themethod of claim 1 , further comprising removing an unused quantity ofsaid energy reactive marking material from said surface.
 22. Asemiconductor device including a surface with a marking thereon, saidmarking comprising energy-reacted material on said surface without beingsubstantially recessed in said surface.
 23. The semiconductor device ofclaim 22 , wherein said energy-reacted material comprises a pigment. 24.The semiconductor device of claim 22 , wherein said energy-reactedmaterial of said marking is at least partially laterally surrounded byunreacted energy-reactive material.
 25. The semiconductor device ofclaim 24 , wherein a color of said energy-reacted material is visiblydifferent from a color of said unreacted energy-reactive material. 26.The semiconductor device of claim 22 , wherein said marking has anon-wet finish.
 27. The semiconductor device of claim 22 , whereinregions of said surface beneath and laterally adjacent said marking aresubstantially free of decomposition and damage.
 28. The semiconductordevice of claim 22 , wherein said marking is at least one of bonded orfused to said surface.
 29. The semiconductor device of claim 22 ,wherein said surface on which said marking is located comprises asurface of a packaging material.
 30. The semiconductor device of claim22 , wherein said surface on which said marking is located comprises asurface of a semiconductor die.